Ansoft to Introduce High-Performance Computing Capability for HFSS at International Microwave Symposium

Latest Version of Industry-Standard Software and Extended Multiphysics Capability to be Showcased

SOUTHPOINTE, Pa - ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced that its subsidiary Ansoft will showcase leading electronics solutions at the International Microwave Symposium (IMS) conference to be held in June. As wireless communication and electronic devices proliferate and become smaller and more functional, the need for robust simulation solutions increases. Ansoft™ software helps engineers design, simulate and validate the behavior of complex high-performance radio frequency (RF), microwave and millimeter-wave devices in next-generation wireless communication and defense systems. Using Ansoft technology, customers can achieve a dramatic reduction in development time and cost, while at the same time realize increased reliability and optimization.

IMS is the world's premier RF/microwave engineering conference, dedicated to the advancement of microwave theory and its applications. During the event, Ansoft will introduce planned enhancements to its industry-standard 3-D full wave electromagnetic field simulation software HFSS™, including domain decomposition, a high-performance computing (HPC) option. The technology, which adds even more depth and breadth to the ANSYS multiphysics suite, enables engineers to solve problems such as electromagnetic-induced heating in high-power microwave structures and antenna performance while under mechanical deformation through links with the ANSYS® Workbench™ platform.

“This year, RF and microwave engineers will discover how our new high-performance computing breakthroughs and multiphysics solutions can deliver remarkable advantages,” said Dr. Lawrence Williams, Ansoft's director of product management. “These advancements will allow engineers designing devices such as antennas, phased arrays, passive RF/mW components, advanced electronic packaging, and RF PCBs the ability to consider many more design possibilities and to solve very large-scale problems faster than ever before. It is another important step in delivering the ANSYS vision of Simulation Driven Product Development™.”

Ansoft will stage in-booth demonstrations during the conference. Ansoft’s advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation can break the cycle of repeated design iterations and lengthy physical prototyping.

Ansoft will be at booth 2207 at the IMS conference, which takes place June 7 to 12 in Boston, Massachusetts, U.S.A.