WESTMINSTER, CA - NEi Software will debut NEi Nastran V10 at SAMPE, a materials and processing technology conference being held in Seattle WA between May 18-20. Engineers will be on hand to demonstrate NEi Nastran V10 along with the suite of engineering software solutions offered by NEi Software. In addition, NEi Software will present a new white paper entitled "Simulating Fiber Metal Laminates" on May 20.
WHEN & WHERE:
SAMPE 2010 Seattle, WA
May 18-20, 2010
Visit NEi Software at booth 1610
Washington State Convention Center
800 Convention Place
Seattle, WA 98101-2350
Presentation
May 20, 2010 at 8:25AM
Session: Design & Analysis IV
FEA White Paper: "Simulating Fiber Metal Laminates"
May 6, 2010
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