Neilsoft will be a sponsor at the 3rd edition of the Nasscom Engineering Summit 2011 scheduled at Pune, India on 12-13 October. The summit will provide a unique platform to understand debate & strategize globalization of engineering, emerging markets and frugal engineering and new models of co-creation. Engineering, R&D, Design, and Innovation - all intertwined and critical aspects of building future products and services will come together at this Summit.
The theme of this two day summit is 'Innovation and High Value Engineering', wherein thought leaders and renowned speakers from the Engineering Industry will share their insights, present case studies and conduct master classes.
A must attend for engineering companies, Global In-house Centers (GIC), engineering services providers, SMEs, academicians, analysts. So be there for two days of action where the globally-renowned speakers will address 600+ participants and rub shoulders with thought leaders from Industry verticals including defense, avionics, automotive R&D, telecom, consumer electronics, medical electronics and heavy engineering.
Popular Articles
- Delcam Sales Partner SEACAM appoints twelfth partner in Brazil
- IMSI Wins InterSystems Breakthrough Application Award
- Delcam CADCAM aids diversification at Cimarron
- Surfware's free SURFCAM Student Learning Version Now Available for download
- AWR Acquires Simulation Technology and Applied Research, Inc. (STAAR)
- Autodesk Completes Acquisition of Horizontal Systems, Inc.
- Delcam’s PartMaker CAM helps Orthopaedic International Inc. in the Philippines
- aPriori Launches New Product Cost Service Bureau
- Precision engineering company Alphateq selects Siemens NX-based CAD/CAM solution from Majenta PLM
- Ontario Power Company Uses SolidWorks to Design Ultra-Efficient Natural Gas Plant