Neilsoft will be a sponsor at the 3rd edition of the Nasscom Engineering Summit 2011 scheduled at Pune, India on 12-13 October. The summit will provide a unique platform to understand debate & strategize globalization of engineering, emerging markets and frugal engineering and new models of co-creation. Engineering, R&D, Design, and Innovation - all intertwined and critical aspects of building future products and services will come together at this Summit.
The theme of this two day summit is 'Innovation and High Value Engineering', wherein thought leaders and renowned speakers from the Engineering Industry will share their insights, present case studies and conduct master classes.
A must attend for engineering companies, Global In-house Centers (GIC), engineering services providers, SMEs, academicians, analysts. So be there for two days of action where the globally-renowned speakers will address 600+ participants and rub shoulders with thought leaders from Industry verticals including defense, avionics, automotive R&D, telecom, consumer electronics, medical electronics and heavy engineering.
Popular Articles
- Automotive Tier-One Suppliers Adopt TPM for Faster, Automated Data Translations
- Femap® From Siemens PLM Software Now Sold Worldwide Through NEi Software's Reseller Network
- Sescoi's WorkNC 5-Axis and Auto 5 - a competitive advantage at ALLIO
- Autodesk Acquires T-Splines Modeling Technology Assets
- Michael Schley named as 2008 ifma fellow
- Visteon Technology Helps Drivers to Be More Aware of Surroundings
- Infotech Enterprises's revenue Rs 2327.5mn for 3rd quarter ended December 31, 2008
- New powerful functionalities for think3’s ThinkDesign 2009.1
- Engineering Simulation Software from ANSYS Used to Help Calibrate Meteorological Instruments on Phoenix Mars Lander
- Applied Technology Group named Autodesk's Reseller of the Quarter for Excellence in Customer Service