Event welcomes presentations from engineering and manufacturing community.
Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today opened its call for speakers for the 2012 event (www.3dcic.com) to be held May 21 to 23 in Denver, Colorado.
Now in its ninth year, CIC is the only vendor-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from automotive, aerospace, heavy equipment, electronics industries, as well as with representatives from government and defense communities.
Conference organizers are looking for presentations from product designers, engineers, IT professionals or supply chain/downstream experts which focus on strategies, trade-offs and/or implementation case stories of real-world solutions in the following areas:
Building collaborative PLM into the global supply chain, including such topics as change order management, intellectual property security and management
Digital product data deployment beyond engineering
Integration of the supply chain into PLM processes
Leveraging social media within corporate and with suppliers
Design-analysis/simulation or design-manufacturing interoperability
PLM migration and legacy data management
Collaboration & interoperability technology and implementation
Anyone interested in speaking at the event should send a proposed title, abstract (250-word maximum), and brief biography to David Prawel at Longview Advisors (dprawel@longviewadvisors.com) by December 30, 2011.
Longview Advisors is pleased to announce free access to all presentations and audios from previous CIC events, now available at www.3dcic.com.
Showing posts with label Events. Show all posts
Showing posts with label Events. Show all posts
Oct 31, 2011
Call For Speakers Opens for 2012 Collaboration & Interoperability Congress (CIC)
Filed under:
Events
Sep 28, 2011
MathWorks to Host second annual MathWorks India User Conference
One-day conference to bring together MATLAB and Simulink users across industries.
MathWorks, the world’s leading developer of software for technical computing and Model-Based Design, will host the second annual MathWorks India User Conference.
Continuing on the lines of the successful inaugural User Conference hosted by MathWorks India in 2010, the second annual MathWorks India User Conference will offer a full day of insightful presentations and demonstrations relevant to engineers, scientists and managers at any level of proficiency from across the industrial spectrum. Sessions will be presented by MathWorks technical experts as well as customers of MathWorks India.
Richard Rovner, vice president of marketing, MathWorks, will deliver the keynote address entitled, “Driving Innovation and Efficiency with Model-Based Design.” This talk will highlight recent applications of Model-Based Design, expose the critical underlying technologies based on MATLAB and Simulink, overview new product enhancements from MathWorks, and touch on the extension of Model-Based Design into academia, ensuring the growth of the next generation of engineers and scientists.
In addition, a MathWorks India customer will deliver a keynote address at the conference.
For the detailed agenda, visit http://www.mathworks.in/company/events/conferences/user-conference-india/index.html.
WHEN: Thursday, 20 October, 2011
WHERE: ITC Gardenia
No. 1, Residency Road
(Next to Mallya Hospital)
Bengaluru – 560 025
India
MathWorks, the world’s leading developer of software for technical computing and Model-Based Design, will host the second annual MathWorks India User Conference.
Continuing on the lines of the successful inaugural User Conference hosted by MathWorks India in 2010, the second annual MathWorks India User Conference will offer a full day of insightful presentations and demonstrations relevant to engineers, scientists and managers at any level of proficiency from across the industrial spectrum. Sessions will be presented by MathWorks technical experts as well as customers of MathWorks India.
Richard Rovner, vice president of marketing, MathWorks, will deliver the keynote address entitled, “Driving Innovation and Efficiency with Model-Based Design.” This talk will highlight recent applications of Model-Based Design, expose the critical underlying technologies based on MATLAB and Simulink, overview new product enhancements from MathWorks, and touch on the extension of Model-Based Design into academia, ensuring the growth of the next generation of engineers and scientists.
In addition, a MathWorks India customer will deliver a keynote address at the conference.
For the detailed agenda, visit http://www.mathworks.in/company/events/conferences/user-conference-india/index.html.
WHEN: Thursday, 20 October, 2011
WHERE: ITC Gardenia
No. 1, Residency Road
(Next to Mallya Hospital)
Bengaluru – 560 025
India
Filed under:
Events,
The MathWorks
Sep 26, 2011
AceCad Software Inc is hosting a SteelDay event
AceCad Software Inc is hosting a SteelDay event on September 23, 2011.
AceCad Software Inc has teamed up with the American Institute of Steel Construction for SteelDay® 2011. AceCad Software will be hosting and invites you to a free of charge webinar demonstrating BIM methodology for the AEC steelwork fabrication industry.
SteelDay®, hosted by the American Institute of Steel Construction (AISC), is an annual national event dedicated to providing the AEC community with accessibility to the latest happenings in the structural steel industry. SteelDay® events are scheduled across the United States for the AEC community to tour facilities and jobsites, attend educational seminars, network, and see how the structural steel industry is contributing to build America. Over 9,000 architects, engineers, contractors, developers and students attended more than 190 free events all over the country at last year’s SteelDay® and feedback was tremendous. More information can be found at www.SteelDay.org
During AceCad Software’s SteelDay® webinar we will show you how you could export an Autodesk® Revit® Architecture Model into AceCad Software’s StruCad 3D steelwork modeling system via a dedicated IFC file format. Then we will cover applying connections, BIM collaboration via StruWalker, and producing structural steelwork fabrication deliverables; including drawings and CAM data from StruCad. Lastly, we will show how the data within the model can be used for fabrication within AceCad Software’s StruM.I.S management information system, enabling efficient production and real time tracking of the construction project within the model.
Register for AceCad Software’s free SteelDay® event via email to sales@strucad.com or if you need any more information call (610) 280 9840
Date: Friday, September 23rd, 2011
Time: 1.00pm - 2.00pm EST
AceCad Software Inc has teamed up with the American Institute of Steel Construction for SteelDay® 2011. AceCad Software will be hosting and invites you to a free of charge webinar demonstrating BIM methodology for the AEC steelwork fabrication industry.
SteelDay®, hosted by the American Institute of Steel Construction (AISC), is an annual national event dedicated to providing the AEC community with accessibility to the latest happenings in the structural steel industry. SteelDay® events are scheduled across the United States for the AEC community to tour facilities and jobsites, attend educational seminars, network, and see how the structural steel industry is contributing to build America. Over 9,000 architects, engineers, contractors, developers and students attended more than 190 free events all over the country at last year’s SteelDay® and feedback was tremendous. More information can be found at www.SteelDay.org
During AceCad Software’s SteelDay® webinar we will show you how you could export an Autodesk® Revit® Architecture Model into AceCad Software’s StruCad 3D steelwork modeling system via a dedicated IFC file format. Then we will cover applying connections, BIM collaboration via StruWalker, and producing structural steelwork fabrication deliverables; including drawings and CAM data from StruCad. Lastly, we will show how the data within the model can be used for fabrication within AceCad Software’s StruM.I.S management information system, enabling efficient production and real time tracking of the construction project within the model.
Register for AceCad Software’s free SteelDay® event via email to sales@strucad.com or if you need any more information call (610) 280 9840
Date: Friday, September 23rd, 2011
Time: 1.00pm - 2.00pm EST
Filed under:
Events
Sep 1, 2011
NASA to Showcase Novel Manufacturing Technology at Forum
NASA is hosting a two-day industry conference, Sept. 20-21, to promote an innovative manufacturing technique that can make metal parts from three-dimensional drawings - even in the zero gravity of space.
Government and industry leaders will discuss the future and possibilities of electron beam freeform fabrication or EBF3, which can be used to make components for aviation, spaceflight, or even the medical industry. At the forum NASA will present a novel technology developed by engineers at the Langley Research Center that can be applied to electron beam welding systems.
NASA's technique consists of an electron beam gun, wire feeder and positioning system inside a vacuum chamber. The beam is focused on a constantly feeding source of metal, which is melted and then accurately applied one layer at a time, according to a computer-aided design (CAD) drawing, to make a 3-D structural part without having to use a mold.
The EBF3 Forum at the Hampton Roads Convention Center will give industry and government participants an opportunity to learn more about NASA's technology and join in discussions on advancements, research and possible funding partnerships.
The forum is sponsored by NASA Langley, Old Dominion University Business Gateway, RTI International and Virginia PLTW. It is open to the public, but registration is required.
Government and industry leaders will discuss the future and possibilities of electron beam freeform fabrication or EBF3, which can be used to make components for aviation, spaceflight, or even the medical industry. At the forum NASA will present a novel technology developed by engineers at the Langley Research Center that can be applied to electron beam welding systems.
NASA's technique consists of an electron beam gun, wire feeder and positioning system inside a vacuum chamber. The beam is focused on a constantly feeding source of metal, which is melted and then accurately applied one layer at a time, according to a computer-aided design (CAD) drawing, to make a 3-D structural part without having to use a mold.
The EBF3 Forum at the Hampton Roads Convention Center will give industry and government participants an opportunity to learn more about NASA's technology and join in discussions on advancements, research and possible funding partnerships.
The forum is sponsored by NASA Langley, Old Dominion University Business Gateway, RTI International and Virginia PLTW. It is open to the public, but registration is required.
Aug 18, 2011
Altair Engineering Announces HyperWorks 11.0 Workshop Series
Altair Engineering, Inc., a leading global provider of simulation technology and engineering services, has announced its HyperWorks 11.0 Americas Rollout Series, a series of one-day workshops aimed at educating customers and partners on the features and updates in HyperWorks 11.0, the latest version of Altair’s computer-aided engineering (CAE) software suite.
HyperWorks 11.0 was officially unveiled during Altair’s 2011 Americas HyperWorks Technology Conference on June 22. Product highlights include the addition of two new software products to the HyperWorks suite: AcuSolve and solidThinking. HyperWorks 11.0 also offers a greatly extended breadth of solver solutions in RADIOSS, allowing engineers to efficiently address today’s complex design challenges.
During the workshops, attendees will receive an overview of HyperWorks 11.0 and learn tips and tricks geared towards increasing efficiency in the workplace. Admission is free, includes lunch and refreshments and the opportunity to engage with Altair application engineers and technical experts for deeper insights into HyperWorks 11.0.
“As we extend the value of HyperWorks with every release, the HyperWorks 11.0 Rollout Series showcases the continued investment in our customers and partners by providing them with a more extensive overview of the newest additions to the HyperWorks suite,” said Michael Humphrey, Vice Presedent, Altair Americas Field Operations. “It is our goal through these events to educate and train our customers and partners on best practices in leveraging our software to its full capacity so that they can continuously improve upon and maximize their productivity.”
Upcoming HyperWorks 11.0 Americas Rollout Series events include:
Western Michigan University College of Engineering
Kalamazoo, MI, August 18
Microsoft Technology Center
Chicago, IL, September 7
Wake Forest University
Winston-Salem, NC, September 14
EDU Day
Troy, MI, September 15
Altair Headquarters
Troy, MI, September 29
Altair Headquarters
Troy, MI, October 5
Attendees of the Kalamazoo and Troy, Mich., and Chicago workshops will be able to participate in hands-on training labs that include a Q&A session with HyperWorks 11.0 experts. Customers and partners interested in attending can register for free on the HyperWorks website.
HyperWorks 11.0 was officially unveiled during Altair’s 2011 Americas HyperWorks Technology Conference on June 22. Product highlights include the addition of two new software products to the HyperWorks suite: AcuSolve and solidThinking. HyperWorks 11.0 also offers a greatly extended breadth of solver solutions in RADIOSS, allowing engineers to efficiently address today’s complex design challenges.
During the workshops, attendees will receive an overview of HyperWorks 11.0 and learn tips and tricks geared towards increasing efficiency in the workplace. Admission is free, includes lunch and refreshments and the opportunity to engage with Altair application engineers and technical experts for deeper insights into HyperWorks 11.0.
“As we extend the value of HyperWorks with every release, the HyperWorks 11.0 Rollout Series showcases the continued investment in our customers and partners by providing them with a more extensive overview of the newest additions to the HyperWorks suite,” said Michael Humphrey, Vice Presedent, Altair Americas Field Operations. “It is our goal through these events to educate and train our customers and partners on best practices in leveraging our software to its full capacity so that they can continuously improve upon and maximize their productivity.”
Upcoming HyperWorks 11.0 Americas Rollout Series events include:
Western Michigan University College of Engineering
Kalamazoo, MI, August 18
Microsoft Technology Center
Chicago, IL, September 7
Wake Forest University
Winston-Salem, NC, September 14
EDU Day
Troy, MI, September 15
Altair Headquarters
Troy, MI, September 29
Altair Headquarters
Troy, MI, October 5
Attendees of the Kalamazoo and Troy, Mich., and Chicago workshops will be able to participate in hands-on training labs that include a Q&A session with HyperWorks 11.0 experts. Customers and partners interested in attending can register for free on the HyperWorks website.
Aug 3, 2011
Cimatron, ISCAR and Hemaq to Host Mold and Die Seminar in Mexico
Cimatron Technologies Inc., a subsidiary of Cimatron Limited (NASDAQ and TASE: CIMT), announced today a seminar for mold and die makers jointly hosted by Cimatron, ISCAR and Hemaq. The seminar will take place on Aug 3 and 4at Hemaq Headquarters in Monterrey, Mexico.
The seminar will include presentations by Hari Sridharan, VP Engineering for Cimatron Technologies Inc., and Doron Cohen, Product Manager at ISCAR.
Live machining will accompany presentations, using two Okuma machines - a 3 Axis MB66V and a 5-Axis MU400 - fitted with ISCAR cutting tools, and programmed by CimatronE. CimatronE is a CAD/CAM software solution for mold, tool and die makers as well as manufacturers of discrete parts that covers the entire manufacturing process from quoting to delivery.
Among the topics that will be covered and demonstrated are high feed cutting and drilling for plate machining. High Feed cutting, programmed by CimatronE, showcases fast material removal with ISCAR's specialized cutters. Drilling is programmed by CimatronE's Automated Drill, which automatically assigns procedures to holes based on their properties. This greatly simplifies NC programming of plates for molds and dies.
The seminar will also feature machining strategies for the production of a mold core for the automotive industry. Positioning and continuous milling on the core will demonstrate the benefits of 5-axis machining with short robust tools to increase quality and shorten machining times.
Cimatron North America offers its products and services throughout Mexico, and partners with Hemaq and ISCAR Mexico to provide full solutions for tool makers and manufacturers which dramatically reduce machining times.
"We are looking forward to this event in Mexico," Mr. Sridharan said, "where mold and die makers will be able to learn how the combined technology solutions that Cimatron, Hemaq and ISCAR provide can greatly speed up NC programming and machining."
The seminar will include presentations by Hari Sridharan, VP Engineering for Cimatron Technologies Inc., and Doron Cohen, Product Manager at ISCAR.
Live machining will accompany presentations, using two Okuma machines - a 3 Axis MB66V and a 5-Axis MU400 - fitted with ISCAR cutting tools, and programmed by CimatronE. CimatronE is a CAD/CAM software solution for mold, tool and die makers as well as manufacturers of discrete parts that covers the entire manufacturing process from quoting to delivery.
Among the topics that will be covered and demonstrated are high feed cutting and drilling for plate machining. High Feed cutting, programmed by CimatronE, showcases fast material removal with ISCAR's specialized cutters. Drilling is programmed by CimatronE's Automated Drill, which automatically assigns procedures to holes based on their properties. This greatly simplifies NC programming of plates for molds and dies.
The seminar will also feature machining strategies for the production of a mold core for the automotive industry. Positioning and continuous milling on the core will demonstrate the benefits of 5-axis machining with short robust tools to increase quality and shorten machining times.
Cimatron North America offers its products and services throughout Mexico, and partners with Hemaq and ISCAR Mexico to provide full solutions for tool makers and manufacturers which dramatically reduce machining times.
"We are looking forward to this event in Mexico," Mr. Sridharan said, "where mold and die makers will be able to learn how the combined technology solutions that Cimatron, Hemaq and ISCAR provide can greatly speed up NC programming and machining."
Aug 2, 2011
Airbus and European Space Agency to deliver keynotes at the 2011 LMS European Aerospace Conference
Airbus and European Space Agency to deliver keynotes at the 2011 LMS European Aerospace Conference.
Leuven, Belgium – LMS International has announced the 2011 LMS European Aerospace Conference to be held at the Hotel Radisson BLU in Toulouse, France on the 5th and 6th of October.
The conference will host Dr. Constantinos Stavrinidis, Head of Mechanical Engineering Department, European Space Agency, Mr. Nicolas Botargues, Head of Vibration & Propulsion Integration, Department EGLAV, Airbus France and Mr. Thomas Wilson, Transnational Head of Aircraft Ground Loads, Flight Physics, Loads and Aeroelastics, EGLLG, Airbus as keynote speakers.
“We are greatly pleased that Dr. Stavrinidis, Mr. Botargues and Mr. Wilson will present their visionary approach to the unique engineering challenges in the aerospace industry” stated Dr. Urbain Vandeurzen, LMS Chairman and CEO, “Our aim is to provide a meeting place for the aerospace community to exchange ideas and find ways to respond to the current challenges in the industry.”
This two-day conference focuses on latest technological evolutions in mechatronic simulation and test-based engineering processes and illustrates their contribution to faster aircraft development and better risk mitigation. Key speakers from the industry will have the opportunity to share their vision and present their strategy to address the next generation of aerospace engineering challenges. The conference is the ideal venue to meet with LMS customers, executives, partners, and experts and discuss best practices and technology updates.
The following companies confirmed their participation:
Airbus, Aeroconseil, Alenia Aeronautica, Boeing, Carleton University Canada, Certia ESA, EADS CASA, Hutchinson Research Center, DLR, EADS Innovation Works, Esterel Technologies, Messier-Bugatti-Dowty, Microtecnica, National Aerospace Laboratories, Onera, Safran Aircelle, Safran Labinal, Safran Turbomeca, Safran Snecma, Sener, Serms, Thales Alenia Space Italia, Universita Napoli Federico II, KHBO Aerospace, University of Manchester, University of Bristol
Please visit http://www.lmsintl.com/events/lmsconferences/europe/aerospace for more information, registration, and practical details about the 2011 LMS European Aerospace Conference.
Leuven, Belgium – LMS International has announced the 2011 LMS European Aerospace Conference to be held at the Hotel Radisson BLU in Toulouse, France on the 5th and 6th of October.
The conference will host Dr. Constantinos Stavrinidis, Head of Mechanical Engineering Department, European Space Agency, Mr. Nicolas Botargues, Head of Vibration & Propulsion Integration, Department EGLAV, Airbus France and Mr. Thomas Wilson, Transnational Head of Aircraft Ground Loads, Flight Physics, Loads and Aeroelastics, EGLLG, Airbus as keynote speakers.
“We are greatly pleased that Dr. Stavrinidis, Mr. Botargues and Mr. Wilson will present their visionary approach to the unique engineering challenges in the aerospace industry” stated Dr. Urbain Vandeurzen, LMS Chairman and CEO, “Our aim is to provide a meeting place for the aerospace community to exchange ideas and find ways to respond to the current challenges in the industry.”
This two-day conference focuses on latest technological evolutions in mechatronic simulation and test-based engineering processes and illustrates their contribution to faster aircraft development and better risk mitigation. Key speakers from the industry will have the opportunity to share their vision and present their strategy to address the next generation of aerospace engineering challenges. The conference is the ideal venue to meet with LMS customers, executives, partners, and experts and discuss best practices and technology updates.
The following companies confirmed their participation:
Airbus, Aeroconseil, Alenia Aeronautica, Boeing, Carleton University Canada, Certia ESA, EADS CASA, Hutchinson Research Center, DLR, EADS Innovation Works, Esterel Technologies, Messier-Bugatti-Dowty, Microtecnica, National Aerospace Laboratories, Onera, Safran Aircelle, Safran Labinal, Safran Turbomeca, Safran Snecma, Sener, Serms, Thales Alenia Space Italia, Universita Napoli Federico II, KHBO Aerospace, University of Manchester, University of Bristol
Please visit http://www.lmsintl.com/events/lmsconferences/europe/aerospace for more information, registration, and practical details about the 2011 LMS European Aerospace Conference.
CERN to host Product Lifecycle Management Conference
Geneva: CERN1 is to host the Geneva International Product Lifecycle Management (PLM) Conference on September 6-7, 2011. The focus of the Conference is the successful implementation and use of PLM.
The Conference will address PLM across the product lifecycle – innovation; development; manufacturing; use/support; retirement/disposal. The provisional Conference Agenda includes speakers from SMEs, as well as from larger organisations such as Bobst, Bombardier Transportation, CERN, CORUM, EADS, European Commission, Givaudan, Jet Aviation, Merck Serono, Mettler Toledo, Salomon, Stadler Rail, SR Technics, Synthes, Transtec Gotthard, and Varian Medical Systems.
PLM is the activity of managing, in the most effective way, an organisation’s products all the way across their lifecycles; from the very first idea for a product all the way through until it is retired and disposed of. PLM has a holistic approach to the management of a product. In addition to the product, it addresses many other resources including data, IT applications, processes, people, work methods, and equipment.
“We’re delighted to be hosting this conference,” said Thomas Pettersson, Head of CERN’s General Services Department. “It’s an opportunity to show that CERN is not only in the vanguard of fundamental physics, but also of responsible product lifecycle management.”
Conference presentations address a wide range of PLM subjects including Application Architecture, Business Process Management, Change Management, Cleantech, Data Cleansing, End-of-Life, Human Resources, Implementation Guidelines, Innovation Management, Internet of Things, Mechatronics, Metrics, NPD/NPI, Portfolio Management, Social Product Development, Standards, Strategy, Sustainability and Vision.
To enable world-leading research into physics, CERN has to carry out great engineering and highly innovative product development. CERN designs, builds and operates particle accelerators that range in size from a few metres long to the LHC, which is 27 km in circumference. These machines and the related experimental areas contain millions of items of many types, such as software, electronics, electrical, mechanical, and chemical.
“It’s a tremendous challenge to develop such highly innovative, high-performance machines,” said Pettersson. “It’s just as challenging to maintain a coherent configuration of everything that's been developed and installed.”
CERN’s integrated PLM platform is called the CERN Engineering & Equipment Data Management System. Developed over the last 15 years, it has 6,400 registered active users located all round the world. It currently manages more than a million components and more than a million documents and drawings.
In recent years, PLM has become a top management issue for companies developing, manufacturing and selling products of all types. During the 2010-2015 period, most companies are expected to launch a PLM Project, Program or Initiative. Executives need to be sure the right objectives are set for PLM, the right visions and strategies are developed, and plans are implemented quickly and correctly. The Geneva International PLM Conference and Exhibition, held in the working environment of a world-renowned organisation, and with speakers from more than 30 leading companies, offers a unique opportunity to learn about the current status of PLM implementations and components, understand PLM best practice, and find out about future developments of PLM.
1. CERN, the European Organization for Nuclear Research, is the world's leading laboratory for particle physics. It has its headquarters in Geneva. At present, its Member States are Austria, Belgium, Bulgaria, the Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Italy, the Netherlands, Norway, Poland, Portugal, Slovakia, Spain, Sweden, Switzerland and the United Kingdom. Romania is a candidate for accession. India, Israel, Japan, the Russian Federation, the United States of America, Turkey, the European Commission and UNESCO have Observer status.
The Conference will address PLM across the product lifecycle – innovation; development; manufacturing; use/support; retirement/disposal. The provisional Conference Agenda includes speakers from SMEs, as well as from larger organisations such as Bobst, Bombardier Transportation, CERN, CORUM, EADS, European Commission, Givaudan, Jet Aviation, Merck Serono, Mettler Toledo, Salomon, Stadler Rail, SR Technics, Synthes, Transtec Gotthard, and Varian Medical Systems.
PLM is the activity of managing, in the most effective way, an organisation’s products all the way across their lifecycles; from the very first idea for a product all the way through until it is retired and disposed of. PLM has a holistic approach to the management of a product. In addition to the product, it addresses many other resources including data, IT applications, processes, people, work methods, and equipment.
“We’re delighted to be hosting this conference,” said Thomas Pettersson, Head of CERN’s General Services Department. “It’s an opportunity to show that CERN is not only in the vanguard of fundamental physics, but also of responsible product lifecycle management.”
Conference presentations address a wide range of PLM subjects including Application Architecture, Business Process Management, Change Management, Cleantech, Data Cleansing, End-of-Life, Human Resources, Implementation Guidelines, Innovation Management, Internet of Things, Mechatronics, Metrics, NPD/NPI, Portfolio Management, Social Product Development, Standards, Strategy, Sustainability and Vision.
To enable world-leading research into physics, CERN has to carry out great engineering and highly innovative product development. CERN designs, builds and operates particle accelerators that range in size from a few metres long to the LHC, which is 27 km in circumference. These machines and the related experimental areas contain millions of items of many types, such as software, electronics, electrical, mechanical, and chemical.
“It’s a tremendous challenge to develop such highly innovative, high-performance machines,” said Pettersson. “It’s just as challenging to maintain a coherent configuration of everything that's been developed and installed.”
CERN’s integrated PLM platform is called the CERN Engineering & Equipment Data Management System. Developed over the last 15 years, it has 6,400 registered active users located all round the world. It currently manages more than a million components and more than a million documents and drawings.
In recent years, PLM has become a top management issue for companies developing, manufacturing and selling products of all types. During the 2010-2015 period, most companies are expected to launch a PLM Project, Program or Initiative. Executives need to be sure the right objectives are set for PLM, the right visions and strategies are developed, and plans are implemented quickly and correctly. The Geneva International PLM Conference and Exhibition, held in the working environment of a world-renowned organisation, and with speakers from more than 30 leading companies, offers a unique opportunity to learn about the current status of PLM implementations and components, understand PLM best practice, and find out about future developments of PLM.
1. CERN, the European Organization for Nuclear Research, is the world's leading laboratory for particle physics. It has its headquarters in Geneva. At present, its Member States are Austria, Belgium, Bulgaria, the Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Italy, the Netherlands, Norway, Poland, Portugal, Slovakia, Spain, Sweden, Switzerland and the United Kingdom. Romania is a candidate for accession. India, Israel, Japan, the Russian Federation, the United States of America, Turkey, the European Commission and UNESCO have Observer status.
Filed under:
Events
May 19, 2011
2011 SIMULIA Customer Conference Features Main Stage Presentations by General Motors, BD, and PSA Peugeot Citroën
Record Number of Presentations Highlight Advances Using Realistic Simulation Technology and Methods.
Dassault Systèmes announced the successful conclusion of the 23rd annual international SIMULIA Customer Conference (SCC), held May 17-19, 2011, in Barcelona, Spain. Keynote addresses from General Motors Powertrain and BD, as well as an invited general lecture by PSA Peugeot Citroën, set the stage for innovative thought leadership discussions focusing on industry applications of SIMULIA’s solutions for unified finite element analysis, multiphysics simulation, design optimization, and simulation lifecycle management.
The guest speakers were complemented by more than 90 presentations by engineers representing more than 80 international manufacturing and research organizations, including Airbus, Abbott Vascular, Cordis Corporation, Fiat Research Center, Ford Motor Company, Halliburton, Hyundai, IDIADA, Medtronic, Rolls-Royce, Xerox, and many others. Sessions covered a broad range of industries including Aerospace, Automotive, Civil Engineering, Defense, Energy, High Tech, Life Sciences, and more.
Keynote Dr. Jayaraman (Siva) Sivakumar, engineering group manager for General Motors Powertrain, described how the effective use of state-of-the-art simulation at the system, sub-system and component level enables GM to deliver powertrains that save fuel and improve the performance of cars and trucks.
BD is a distinct leader in the medical manufacturing industry as the company adopted the use of Computer-Aided Engineering (CAE) tools approximately 25 years ago to optimize medical product manufacturability and performance. Anita Bestelmeyer, CAE manager for BD, discussed how her team is utilizing SIMULIA realistic simulation technologies to help deliver optimal, robust and high-quality products to the market faster and at a reduced cost.
Benoît Guillaume, numerical optimization expert for PSA Peugeot Citroën, outlined the deployment of their Automation and Optimization Platform, which is based on SIMULIA’s Isight and SIMULIA Execution Engine software. The objective of the platform is to improve operational efficiency and capitalize on best practices.
“The record number of paper submissions this year demonstrates the high value our customers place on sharing their experience at our annual gathering of realistic simulation thought-leaders,” says Ken Short, VP of Strategy and Marketing, SIMULIA, Dassault Systèmes. “Leading this outstanding roster of presenters, Siva, Anita, and Benoît provided insight into how their companies are using realistic simulation to gain a competitive advantage by exploring and improving the real-world performance, safety, and quality of their products.”
CD-adapco and Microsoft were the Premier Sponsors of the 2011 SCC. They were joined in the Partner Exhibition by 20 other SIMULIA partner sponsors including Anybody Technology, AVL List GmbH, BETA CAE Systems, CAPVIDIA, Cenaero, Core Tech System Co., Ltd., DatapointLabs, e-Xstream engineering SA, Fraunhofer Institute SCAI, Fujitsu, Granta Design, Intel, JSOL Corporation, LMS International, NVIDIA Corporation, Northwest Numerics & Modeling, Platform Computing, Safe Technology Ltd., Silicon Graphics, Inc., Simpleware Ltd., and Zentech International Ltd.
Dassault Systèmes announced the successful conclusion of the 23rd annual international SIMULIA Customer Conference (SCC), held May 17-19, 2011, in Barcelona, Spain. Keynote addresses from General Motors Powertrain and BD, as well as an invited general lecture by PSA Peugeot Citroën, set the stage for innovative thought leadership discussions focusing on industry applications of SIMULIA’s solutions for unified finite element analysis, multiphysics simulation, design optimization, and simulation lifecycle management.
The guest speakers were complemented by more than 90 presentations by engineers representing more than 80 international manufacturing and research organizations, including Airbus, Abbott Vascular, Cordis Corporation, Fiat Research Center, Ford Motor Company, Halliburton, Hyundai, IDIADA, Medtronic, Rolls-Royce, Xerox, and many others. Sessions covered a broad range of industries including Aerospace, Automotive, Civil Engineering, Defense, Energy, High Tech, Life Sciences, and more.
Keynote Dr. Jayaraman (Siva) Sivakumar, engineering group manager for General Motors Powertrain, described how the effective use of state-of-the-art simulation at the system, sub-system and component level enables GM to deliver powertrains that save fuel and improve the performance of cars and trucks.
BD is a distinct leader in the medical manufacturing industry as the company adopted the use of Computer-Aided Engineering (CAE) tools approximately 25 years ago to optimize medical product manufacturability and performance. Anita Bestelmeyer, CAE manager for BD, discussed how her team is utilizing SIMULIA realistic simulation technologies to help deliver optimal, robust and high-quality products to the market faster and at a reduced cost.
Benoît Guillaume, numerical optimization expert for PSA Peugeot Citroën, outlined the deployment of their Automation and Optimization Platform, which is based on SIMULIA’s Isight and SIMULIA Execution Engine software. The objective of the platform is to improve operational efficiency and capitalize on best practices.
“The record number of paper submissions this year demonstrates the high value our customers place on sharing their experience at our annual gathering of realistic simulation thought-leaders,” says Ken Short, VP of Strategy and Marketing, SIMULIA, Dassault Systèmes. “Leading this outstanding roster of presenters, Siva, Anita, and Benoît provided insight into how their companies are using realistic simulation to gain a competitive advantage by exploring and improving the real-world performance, safety, and quality of their products.”
CD-adapco and Microsoft were the Premier Sponsors of the 2011 SCC. They were joined in the Partner Exhibition by 20 other SIMULIA partner sponsors including Anybody Technology, AVL List GmbH, BETA CAE Systems, CAPVIDIA, Cenaero, Core Tech System Co., Ltd., DatapointLabs, e-Xstream engineering SA, Fraunhofer Institute SCAI, Fujitsu, Granta Design, Intel, JSOL Corporation, LMS International, NVIDIA Corporation, Northwest Numerics & Modeling, Platform Computing, Safe Technology Ltd., Silicon Graphics, Inc., Simpleware Ltd., and Zentech International Ltd.
May 11, 2011
LMS International to showcase pioneering mechatronic Vehicle Energy Management solutions
UK event promises to attract leaders in the automotive industry.
LMS International will present its latest Vehicle Energy Management (VEM) research at the Vehicle Thermal Management Systems (VTMS)conference to be held at the Heritage Motor Centre in Warwickshire, United Kingdom from May 15 - 19, 2011.
Promising to attract leaders in the automotive industry, VTMS is the place to be for anyone involved in the field of heat and vehicle thermal management. Literally a hot topic, mechatronic-based Vehicle Energy Management is just one example of the cutting-edge technology that will be discussed, debated and explored during this 5-day event. LMS will present a paper on the topic entitled, ‘Balancing vehicle energy performance and thermal comfort: benefits of a multi-domain system simulation approach in the case of a power-split hybrid-electric vehicle.’ The paper uncovers the critical role of system simulation in the vehicle energy management arena. It investigates how best to handle conflicting issues like driver comfort, safety, total vehicle cost and reduced fuel consumption.
In addition, LMS thermal management experts will be on hand at booth #24 to give live demonstrations as well as answer any questions regarding the LMS VEM solution areas: drivability, engine integration and thermal management.
“As part of the latest LMS Imagine.Lab AMESim release, LMS Vehicle Energy Management solutions are highly appreciated by our customers. It provides a way to deal with tough eco-engineering challenges like fuel economy and reduced emissions while optimizing vehicle attributes, such as comfort, performance, drivability and NVH,” stated Stefaan Goossens, Vice President Simulation, LMS International. “With our solution, automotive OEMS solve the issue of how to best integrate ‘green’ engineering into the current development process while continuing to improve performance.”
LMS International will present its latest Vehicle Energy Management (VEM) research at the Vehicle Thermal Management Systems (VTMS)conference to be held at the Heritage Motor Centre in Warwickshire, United Kingdom from May 15 - 19, 2011.
Promising to attract leaders in the automotive industry, VTMS is the place to be for anyone involved in the field of heat and vehicle thermal management. Literally a hot topic, mechatronic-based Vehicle Energy Management is just one example of the cutting-edge technology that will be discussed, debated and explored during this 5-day event. LMS will present a paper on the topic entitled, ‘Balancing vehicle energy performance and thermal comfort: benefits of a multi-domain system simulation approach in the case of a power-split hybrid-electric vehicle.’ The paper uncovers the critical role of system simulation in the vehicle energy management arena. It investigates how best to handle conflicting issues like driver comfort, safety, total vehicle cost and reduced fuel consumption.
In addition, LMS thermal management experts will be on hand at booth #24 to give live demonstrations as well as answer any questions regarding the LMS VEM solution areas: drivability, engine integration and thermal management.
“As part of the latest LMS Imagine.Lab AMESim release, LMS Vehicle Energy Management solutions are highly appreciated by our customers. It provides a way to deal with tough eco-engineering challenges like fuel economy and reduced emissions while optimizing vehicle attributes, such as comfort, performance, drivability and NVH,” stated Stefaan Goossens, Vice President Simulation, LMS International. “With our solution, automotive OEMS solve the issue of how to best integrate ‘green’ engineering into the current development process while continuing to improve performance.”
Filed under:
Events
General Motors and Chrysler to deliver keynotes at the 2011 LMS Americas Automotive & Ground Vehicle Conference
Troy, MI – LMS North America has announced the keynote speakers at the 2011 LMS Americas Vehicle Conference to be held at the Dearborn Hyatt Regency Hotel in Dearborn, Michigan on the 14th and 15th of June. The conference will host Mr. Charlie Klein, Global Director Energy Management, Mass and Aerodynamics at General Motors, Mr. Bob Lee, Vice President, Electrified Propulsion & Advanced Powertrain Engineering at Chrysler LLC and Mr. Jan Leuridan, CTO of LMS International as Keynote speakers.
"We are greatly pleased that Mr. Charlie Klein and Mr. Bob Lee will present their visionary approach to the eco- and brand value engineering challenges in the automotive sector." commented Mr. Marc Boonen, President – LMS Americas. "Our aim is to provide a meeting place for the automotive and ground vehicle community to exchange ideas and find ways to respond to the current challenges in the industry."
LMS is also happy to announce our lunch-time guest speaker for this year’s conference will be Mr. John McElroy. Mr. McElroy is the host of "Autoline Detroit," an Emmy Award-winning TV program, and is heard daily on "Automotive Insight" segments on WWJ Newsradio 950, the CBS affiliate in Detroit. John is well known in the Automotive Industry and his experience and unique global perspective will make for a valuable presentation at the Keynote lunch on the 14th.
The afternoon of the 14th will have two management panel sessions with industry leaders discussing the following topics:
Model Based Systems Engineering (MBSE) – A product development enabler for attaining performance and quality targets, and
Vehicle Engineering – Delivering best-in-class vehicle performance and driving experiences through superior systems engineering
The Second day of the conference will host leading engineering application cases presented by our customers and other experts on the use of LMS solutions and technology to solve their engineering needs. These presentations will be categorized into three tracks covering physical testing, virtual simulation and model-based systems engineering providing a view on our customer’s engineering and technology successes.
The two-day conference is the ideal venue to discover real-life business applications and the latest technological evolutions presented by leading industry experts, and to experience test and mechatronic simulation solutions from LMS and its partners. The conference will bring together engineering executives, senior managers, and technical experts who will share strategies that illustrate how simulation supported by continuous progress in physical testing has helped them optimize their products and product development processes.
The following companies have already confirmed their participation: General Motors, Chrysler LLC, Ford Motor Company, LG-CPI, International Automotive Components (IAC), Maruti Udyog (India), UofM Automotive Research Center (ARC), National Renewable Energy Laboratory (NREL) among others.
"We are greatly pleased that Mr. Charlie Klein and Mr. Bob Lee will present their visionary approach to the eco- and brand value engineering challenges in the automotive sector." commented Mr. Marc Boonen, President – LMS Americas. "Our aim is to provide a meeting place for the automotive and ground vehicle community to exchange ideas and find ways to respond to the current challenges in the industry."
LMS is also happy to announce our lunch-time guest speaker for this year’s conference will be Mr. John McElroy. Mr. McElroy is the host of "Autoline Detroit," an Emmy Award-winning TV program, and is heard daily on "Automotive Insight" segments on WWJ Newsradio 950, the CBS affiliate in Detroit. John is well known in the Automotive Industry and his experience and unique global perspective will make for a valuable presentation at the Keynote lunch on the 14th.
The afternoon of the 14th will have two management panel sessions with industry leaders discussing the following topics:
Model Based Systems Engineering (MBSE) – A product development enabler for attaining performance and quality targets, and
Vehicle Engineering – Delivering best-in-class vehicle performance and driving experiences through superior systems engineering
The Second day of the conference will host leading engineering application cases presented by our customers and other experts on the use of LMS solutions and technology to solve their engineering needs. These presentations will be categorized into three tracks covering physical testing, virtual simulation and model-based systems engineering providing a view on our customer’s engineering and technology successes.
The two-day conference is the ideal venue to discover real-life business applications and the latest technological evolutions presented by leading industry experts, and to experience test and mechatronic simulation solutions from LMS and its partners. The conference will bring together engineering executives, senior managers, and technical experts who will share strategies that illustrate how simulation supported by continuous progress in physical testing has helped them optimize their products and product development processes.
The following companies have already confirmed their participation: General Motors, Chrysler LLC, Ford Motor Company, LG-CPI, International Automotive Components (IAC), Maruti Udyog (India), UofM Automotive Research Center (ARC), National Renewable Energy Laboratory (NREL) among others.
Filed under:
Events
May 2, 2011
SGI CEO and CTO to Speak at 9th Annual SGI User Group Conference
The worldwide SGI User Group is hosting the 9th annual SGIUG Conference on May 2-5, 2011. Attendees can listen to and participate in technical presentations highlighting how SGI’s leading technology solutions are instrumental in helping customers, in a diverse range of industries, solve business-critical, data-intensive technical computing challenges.
SGI CEO Mark Barrenechea will present the opening keynote address, SGI CTO Dr. Eng Lim Goh will deliver the technical keynote address, and executives from National Geographic, NASA Ames Research Center, the Pittsburgh Supercomputing Center, Intel and Imperial College (London) will be presenting other keynote and technical presentations. In addition, attendees can participate in any of the 45 highly technical tracks currently on the agenda, covering the subjects of high performance computing (HPC) and storage technologies.
SGI has more than twenty years of experience in the HPC and storage industries. The Company focuses on providing customers with leading HPC technology and solutions to help them attain the highest levels of compute performance.
Registration for the 2011 SGIUG Conference registration is now open. For more information about the 2011 SGIUG Conference, please visit www.sgiug.org
When: May 2, 2011 through May 5, 2011
Where: The Silicon Valley Marriott Hotel, 46100 Landing Parkway, Fremont, Calif.
SGI CEO Mark Barrenechea will present the opening keynote address, SGI CTO Dr. Eng Lim Goh will deliver the technical keynote address, and executives from National Geographic, NASA Ames Research Center, the Pittsburgh Supercomputing Center, Intel and Imperial College (London) will be presenting other keynote and technical presentations. In addition, attendees can participate in any of the 45 highly technical tracks currently on the agenda, covering the subjects of high performance computing (HPC) and storage technologies.
SGI has more than twenty years of experience in the HPC and storage industries. The Company focuses on providing customers with leading HPC technology and solutions to help them attain the highest levels of compute performance.
Registration for the 2011 SGIUG Conference registration is now open. For more information about the 2011 SGIUG Conference, please visit www.sgiug.org
When: May 2, 2011 through May 5, 2011
Where: The Silicon Valley Marriott Hotel, 46100 Landing Parkway, Fremont, Calif.
Filed under:
Events
Apr 19, 2011
Collaboration & Interoperability Event Attracts New Sponsors : Longview Advisors
LOVELAND, Colo - Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC) (www.3dcic.com), today announced the corporate underwriters of this year's event.
Corporate sponsors to date of the 2011 Congress include: Actify, Autodesk, CENIT North America, CT Core Technologies, Dassault Systemes, Hewlett-Packard, Intel, ITI TranscenData, Kubotek, mental images, Noble Tek, Parametric Technology Corp., 3D PDF Consortium, Right Hemisphere, Spatial, Tetra 4D, Theorem Solutions and Trubiquity. Promotional sponsors include the ConnectPress group of CAD communities (e.g. CATIA Community, Pro-E Community, UG Community), Desktop Engineering Magazine, MCADCafe and Tenlinks.
"Autodesk is proud to support this year's Collaboration and Interoperability Congress," according to Robert "Buzz" Kross, senior vice president, Manufacturing Industry Group at Autodesk. "The CIC event is truly unique. It brings together the best and brightest from across the manufacturing industry to address some of the most difficult customer challenges."
"We want to publically acknowledge the generosity of our sponsors who make this gathering possible -- and make it better -- every year," says David Prawel, president of Longview Advisors. "Our list of sponsors is an impressive assembly of the industry leaders in collaboration and interoperability, who each year provide guiding light into the keys to innovation."
Now in its eighth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.
Visit the website (www.3dcic.com) to find out more about the event, and for free access to all presentations and audios from the 2010, 2009 and 2008 events.
Corporate sponsors to date of the 2011 Congress include: Actify, Autodesk, CENIT North America, CT Core Technologies, Dassault Systemes, Hewlett-Packard, Intel, ITI TranscenData, Kubotek, mental images, Noble Tek, Parametric Technology Corp., 3D PDF Consortium, Right Hemisphere, Spatial, Tetra 4D, Theorem Solutions and Trubiquity. Promotional sponsors include the ConnectPress group of CAD communities (e.g. CATIA Community, Pro-E Community, UG Community), Desktop Engineering Magazine, MCADCafe and Tenlinks.
"Autodesk is proud to support this year's Collaboration and Interoperability Congress," according to Robert "Buzz" Kross, senior vice president, Manufacturing Industry Group at Autodesk. "The CIC event is truly unique. It brings together the best and brightest from across the manufacturing industry to address some of the most difficult customer challenges."
"We want to publically acknowledge the generosity of our sponsors who make this gathering possible -- and make it better -- every year," says David Prawel, president of Longview Advisors. "Our list of sponsors is an impressive assembly of the industry leaders in collaboration and interoperability, who each year provide guiding light into the keys to innovation."
Now in its eighth year, the annual CIC brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.
Visit the website (www.3dcic.com) to find out more about the event, and for free access to all presentations and audios from the 2010, 2009 and 2008 events.
Apr 6, 2011
Lineup for 2011 Collaboration & Interoperability Congress Announced
LOVELAND, Colo - Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today announced its lineup of speakers for the 2011 event. The agenda is available at the congress website, www.3dcic.com.
Now in its eighth year, the annual CIC (www.3dcic.com) brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.
The CIC program is highlighted by the following information-packed presentations and panels of industry experts:
Challenges and Solutions in Development and Design by Dick Morley, Director of Innovation, Cyon Research; Founder, "The Barn"
Countering the Braindrain Threat to Engineering by Kiho Sohn, (former) Chief Knowledge Officer, Pratt & Whitney Rocketdyne
Accelerating Innovation in Today's Engineering Organization by Chad Jackson, President and Founder of Lifecycle Insights
Overview & Status of Model-Based Enterprise (MBE) Standards by Ric Norton, Program Manager and Technical Data Analyst for the Defense Logistics Agency (DLA) Logistics Information Service
If You Build It, Will They Come? – PMI from the other side by John Callen, Product Manager, Inventor PLG, Manufacturing Industry Group, Autodesk
Update on Global LOTAR Status, Activities and Solutions by Rick Zuray, Technical Principal, Boeing
Using Standards & Visualization formats to Implement 3D Manufacturing Instructions for Long Term Data Archiving by Trevor Leeson, Consultancy & Services Director, Theorem Solutions
Trends and Best Practices in Collaboration & Interoperability: Results from the Sixth Annual Survey by Dr. David Prawel, President, Longview Advisors Inc.
Making 3D Product Data Cheap and Available - Added Value with JT and STEP By Dr. Andreas Schreiber, President, PROSTEP Inc.
Incorporating STEP and Collaborative Formats Together into the Product Lifecycle by Dr. Nathan Hartman, Assistant Department Head, Department of Computer Graphics Technology, Purdue University; Philip Rosche, Senior Associate, ICF International; Kevin Fischer, Advanced Manufacturing Technology, Rockwell Collins
Integrated Product Development with CATIA V6 and SAP by Reinhard Staebler, Vice President – SAP Solutions, CENIT North America
Panel: Getting the Most From Your Engineering Organization
Panelists: Four Senior Engineering Management participants?
Exploring the Latest Technologies for Accelerating Secure Collaboration by Wes Shimanek, Workstation Product Manager, Intel Architecture Group, with guests Nate Nalven, Director Engineering Applications at Northrop Grumman and Chuck Brown, Cloud Technology Director at Intel
Deploying PLM to Drive Enterprise Collaboration Standards by Rick Mihelic, Engineering Systems Manager, Peterbilt Motors Company
Model-Based Enterprise (MBE) Pilot Programs Overview & Status by Rich Eckenrode, President, Recon Services
Mitigating Risk in PLM Migration - A Tale of Transition by Vijay Vasandani, VP & GM, NobleTek
MBE PLM Technical Data Plan - Definition Update/Status by Roy Wittenburg, Project Manager for UTRS, US Army
Panel B: Empowering Engineering Decision Making
Panelists: Four Senior Engineering Management
Automotive Industry Visualization Standards Based Interoperability: A Global Industry Initiative by Doug Halliday, Director - Strategic Business Development, Trubiquity
Leveraging Photorealistic 3D Web Applications in the Cloud for Supply Chain Collaboration by Phil Lunn, CTO, Bunkspeed
Open Source in PLM by Marc Lind, Senior Vice President, Aras
Panel: Collaboration & Interoperability Industry Update
Panelists: Senior representatives from the Major CAD and Interoperability companies
Now in its eighth year, the annual CIC (www.3dcic.com) brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.
The CIC program is highlighted by the following information-packed presentations and panels of industry experts:
Challenges and Solutions in Development and Design by Dick Morley, Director of Innovation, Cyon Research; Founder, "The Barn"
Countering the Braindrain Threat to Engineering by Kiho Sohn, (former) Chief Knowledge Officer, Pratt & Whitney Rocketdyne
Accelerating Innovation in Today's Engineering Organization by Chad Jackson, President and Founder of Lifecycle Insights
Overview & Status of Model-Based Enterprise (MBE) Standards by Ric Norton, Program Manager and Technical Data Analyst for the Defense Logistics Agency (DLA) Logistics Information Service
If You Build It, Will They Come? – PMI from the other side by John Callen, Product Manager, Inventor PLG, Manufacturing Industry Group, Autodesk
Update on Global LOTAR Status, Activities and Solutions by Rick Zuray, Technical Principal, Boeing
Using Standards & Visualization formats to Implement 3D Manufacturing Instructions for Long Term Data Archiving by Trevor Leeson, Consultancy & Services Director, Theorem Solutions
Trends and Best Practices in Collaboration & Interoperability: Results from the Sixth Annual Survey by Dr. David Prawel, President, Longview Advisors Inc.
Making 3D Product Data Cheap and Available - Added Value with JT and STEP By Dr. Andreas Schreiber, President, PROSTEP Inc.
Incorporating STEP and Collaborative Formats Together into the Product Lifecycle by Dr. Nathan Hartman, Assistant Department Head, Department of Computer Graphics Technology, Purdue University; Philip Rosche, Senior Associate, ICF International; Kevin Fischer, Advanced Manufacturing Technology, Rockwell Collins
Integrated Product Development with CATIA V6 and SAP by Reinhard Staebler, Vice President – SAP Solutions, CENIT North America
Panel: Getting the Most From Your Engineering Organization
Panelists: Four Senior Engineering Management participants?
Exploring the Latest Technologies for Accelerating Secure Collaboration by Wes Shimanek, Workstation Product Manager, Intel Architecture Group, with guests Nate Nalven, Director Engineering Applications at Northrop Grumman and Chuck Brown, Cloud Technology Director at Intel
Deploying PLM to Drive Enterprise Collaboration Standards by Rick Mihelic, Engineering Systems Manager, Peterbilt Motors Company
Model-Based Enterprise (MBE) Pilot Programs Overview & Status by Rich Eckenrode, President, Recon Services
Mitigating Risk in PLM Migration - A Tale of Transition by Vijay Vasandani, VP & GM, NobleTek
MBE PLM Technical Data Plan - Definition Update/Status by Roy Wittenburg, Project Manager for UTRS, US Army
Panel B: Empowering Engineering Decision Making
Panelists: Four Senior Engineering Management
Automotive Industry Visualization Standards Based Interoperability: A Global Industry Initiative by Doug Halliday, Director - Strategic Business Development, Trubiquity
Leveraging Photorealistic 3D Web Applications in the Cloud for Supply Chain Collaboration by Phil Lunn, CTO, Bunkspeed
Open Source in PLM by Marc Lind, Senior Vice President, Aras
Panel: Collaboration & Interoperability Industry Update
Panelists: Senior representatives from the Major CAD and Interoperability companies
Mar 31, 2011
CD-adapco's STAR European Conference 2011 an Engineering Success
After two decades in London, CD-adapco's STAR European Conference 2011 moved to a seaside town just 20 minutes from Amsterdam’s Schiphol Airport. Noordwijk was an ideal location for the conference this year. Travel to and from the Grand Hotel Huis ter Duin was a breeze for CD-adapco’s European customers and the beach view didn’t hurt either.
The theme of CD-adapco’s STAR conferences for 2011 is “Engineering Success.” The presentations given and attendees’ feedback from the STAR European Conference have already proved this theme to be very appropriate.
During his welcome speech, CD-adapco’s Senior Vice President, Bill Clark, said, “CD-adapco's purpose is to inspire innovation while reducing costs through the application of engineering simulation.” He reported, “We are on track to meet our target of $135 Million end user spend and have seen an organic growth of 17-20% over past 5 years.
The latest customer satisfaction survey shows 95% of CD-adapco customers are satisfied with CD-adapco Software and Services and 97% of customers would recommend CD-adapco.” These numbers are very encouraging in supporting the continuing growth and reinvestment into the company.
Dr. Line Gulstad, Manager, Global Flow Solutions, Wind and Site Competence Centre for Vestas Technology R&D was the Keynote Speaker at the conference and presented how Vestas has achieved Engineering Success by working with CD-adapco. Dr. Gulstad complimented the excellent service and support CD-adapco has provided for over a number of years. She continued, "CD-adapco has certainly inspired innovation at Vestas."
The STAR European Conference was also the official release event for STAR-CCM+ v6, the latest, greatest, version of CD-adapco’s flagship simulation tool. Attendees learned firsthand from experts at the STAR-CCM+ Lab and were equipped with a wealth of hints and tricks to make their own CAE process more effective from the outset.
An exciting session during the conference was when CD-adapco displayed its Discrete Element Modeling (DEM) feature in STAR-CCM+ v6 by playing a lottery to win an iPad. The engineers presenting the feature had used STAR-CCM+ to model and run a simulation of a lottery machine selecting numbered balls. The attendee with the matching numbers in his proceedings booklet won. The winner was Dr. Heinrich Reister from Daimler AG.
Ultimately, because the STAR European Conference 2011 was such an “Engineering Success,” CD-adapco has decided to return for the STAR European Conference 2012.
The theme of CD-adapco’s STAR conferences for 2011 is “Engineering Success.” The presentations given and attendees’ feedback from the STAR European Conference have already proved this theme to be very appropriate.
During his welcome speech, CD-adapco’s Senior Vice President, Bill Clark, said, “CD-adapco's purpose is to inspire innovation while reducing costs through the application of engineering simulation.” He reported, “We are on track to meet our target of $135 Million end user spend and have seen an organic growth of 17-20% over past 5 years.
The latest customer satisfaction survey shows 95% of CD-adapco customers are satisfied with CD-adapco Software and Services and 97% of customers would recommend CD-adapco.” These numbers are very encouraging in supporting the continuing growth and reinvestment into the company.
Dr. Line Gulstad, Manager, Global Flow Solutions, Wind and Site Competence Centre for Vestas Technology R&D was the Keynote Speaker at the conference and presented how Vestas has achieved Engineering Success by working with CD-adapco. Dr. Gulstad complimented the excellent service and support CD-adapco has provided for over a number of years. She continued, "CD-adapco has certainly inspired innovation at Vestas."
The STAR European Conference was also the official release event for STAR-CCM+ v6, the latest, greatest, version of CD-adapco’s flagship simulation tool. Attendees learned firsthand from experts at the STAR-CCM+ Lab and were equipped with a wealth of hints and tricks to make their own CAE process more effective from the outset.
An exciting session during the conference was when CD-adapco displayed its Discrete Element Modeling (DEM) feature in STAR-CCM+ v6 by playing a lottery to win an iPad. The engineers presenting the feature had used STAR-CCM+ to model and run a simulation of a lottery machine selecting numbered balls. The attendee with the matching numbers in his proceedings booklet won. The winner was Dr. Heinrich Reister from Daimler AG.
Ultimately, because the STAR European Conference 2011 was such an “Engineering Success,” CD-adapco has decided to return for the STAR European Conference 2012.
Mar 30, 2011
Longview Extends Early Registration Discount for Collaboration & Interoperability Event
LOVELAND, Colo - Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (CIC), today announced the early registration discount for this year's event will be extended until April 21.
Until May 1, full registrations will cost $795, a $200 savings. After that date, the price will increase to $895 for web registrations until May 21, then $995 at the door.
Now in its eighth year, the annual CIC (www.3dcic.com) brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business.
The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.
Until May 1, full registrations will cost $795, a $200 savings. After that date, the price will increase to $895 for web registrations until May 21, then $995 at the door.
Now in its eighth year, the annual CIC (www.3dcic.com) brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business.
The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.
Filed under:
Events
Mar 21, 2011
ESPRIT 2011 at the 12th CIMT, Beijing, China, April 11-16
DP Technology, creator of ESPRIT®, will exhibit ESPRIT 2011, the latest version of its innovative software, at the 12th Annual China International Machine Tool Show, or CIMT, in Beijing, China, April 11-16.
Scheduled to take place at the China International Exhibition Center, the China International Machine Tool Show is a comprehensive event that offers the latest cutting-edge solutions and machine-tool technologies, as well as dynamic educational seminars.
Visitors to CIMT are encouraged to visit ESPRIT at booth No. 102, where knowledgeable DP representatives will be available to discuss vital upgrades and perform demonstrations of how those upgrades can be put to work for you.
New to ESPRIT 2011 are a series of analysis tools — the zebra, porcupine, heat map and toolpath analysis commands —that provide graphic displays for the inspection of solid models and ease in programming.
The ‘Zebra’ command simulates the reflection of long strips of light on a shiny surface, making it easy to spot wrinkles or defects in a surface. The striped display also makes it easier to verify that two adjacent faces are in contact, are tangent, or have continuous curvature. If stripes smoothly connect from one face to another, elements are tangent. This tool can save substantial time and money by enabling the detection of part model imperfection before parts are machined.
The 'Porcupine' command displays normal vectors on faces and surfaces to aid in the visualization of changes in part curvature, which assists with the selection of ideal machining strategies.
The ‘Heat Map’ command displays surfaces rendered in different colors according to the local radius of curvature. This allows users to review minimum and maximum curvatures for the selection of the most appropriate cutting tools.
The 'toolpath analysis' command traces the position of the tool along a selected toolpath to aid in evaluating toolpath smoothness and to examine the quality of point distribution.
Scheduled to take place at the China International Exhibition Center, the China International Machine Tool Show is a comprehensive event that offers the latest cutting-edge solutions and machine-tool technologies, as well as dynamic educational seminars.
Visitors to CIMT are encouraged to visit ESPRIT at booth No. 102, where knowledgeable DP representatives will be available to discuss vital upgrades and perform demonstrations of how those upgrades can be put to work for you.
New to ESPRIT 2011 are a series of analysis tools — the zebra, porcupine, heat map and toolpath analysis commands —that provide graphic displays for the inspection of solid models and ease in programming.
The ‘Zebra’ command simulates the reflection of long strips of light on a shiny surface, making it easy to spot wrinkles or defects in a surface. The striped display also makes it easier to verify that two adjacent faces are in contact, are tangent, or have continuous curvature. If stripes smoothly connect from one face to another, elements are tangent. This tool can save substantial time and money by enabling the detection of part model imperfection before parts are machined.
The 'Porcupine' command displays normal vectors on faces and surfaces to aid in the visualization of changes in part curvature, which assists with the selection of ideal machining strategies.
The ‘Heat Map’ command displays surfaces rendered in different colors according to the local radius of curvature. This allows users to review minimum and maximum curvatures for the selection of the most appropriate cutting tools.
The 'toolpath analysis' command traces the position of the tool along a selected toolpath to aid in evaluating toolpath smoothness and to examine the quality of point distribution.
Filed under:
DP Technology,
ESPRIT,
Events
ESPRIT 2011 at PMTS 2011, Columbus, Ohio, April 19-21
DP Technology, creator of ESPRIT®, will exhibit ESPRIT 2011, the latest version of its innovative software, at Precision Machining Technology Show, or PMTS, 2011, scheduled for April 19-21 in Columbus, Ohio.
PMTS, a biennial international forum for manufacturers, suppliers and users of products dedicated to the production of precision-machined and turned parts, will take place this year at the Greater Columbus Convention Center.
Visitors to PMTS 2011 are encouraged to visit ESPRIT at booth No. 1010, where knowledgeable DP representatives will be available to discuss vital upgrades and perform demonstrations of how those upgrades can be put to work for you.
SolidTurn® drilling has been enhanced in ESPRIT 2011 with the addition of “Full Clearance” as an option for “Return Plane.” The advantage of adding the “Full Clearance” option to the drilling cycle is that the user can set and view the distance on the technology page.
To better support Swiss-style turning, a new lead-out option, called “Edge Break,” has been added to ESPRIT 2011. Swiss-style lathes utilize a guide bushing to support the bar stock for better rigidity. Occasionally, it is necessary to retract the turned stock back into the guide bushing. If there is a burr on the outer diameter (OD) of the stock, the guide bushing could jam or be damaged when the stock retracts. The new “Edge Break” option for the lead-out move will create a chamfer move to break the edge of the stock at the OD.
PMTS, a biennial international forum for manufacturers, suppliers and users of products dedicated to the production of precision-machined and turned parts, will take place this year at the Greater Columbus Convention Center.
Visitors to PMTS 2011 are encouraged to visit ESPRIT at booth No. 1010, where knowledgeable DP representatives will be available to discuss vital upgrades and perform demonstrations of how those upgrades can be put to work for you.
SolidTurn® drilling has been enhanced in ESPRIT 2011 with the addition of “Full Clearance” as an option for “Return Plane.” The advantage of adding the “Full Clearance” option to the drilling cycle is that the user can set and view the distance on the technology page.
To better support Swiss-style turning, a new lead-out option, called “Edge Break,” has been added to ESPRIT 2011. Swiss-style lathes utilize a guide bushing to support the bar stock for better rigidity. Occasionally, it is necessary to retract the turned stock back into the guide bushing. If there is a burr on the outer diameter (OD) of the stock, the guide bushing could jam or be damaged when the stock retracts. The new “Edge Break” option for the lead-out move will create a chamfer move to break the edge of the stock at the OD.
Filed under:
DP Technology,
ESPRIT,
Events
Mar 16, 2011
SpaceClaim to host Presentations by Customers and SpaceClaim Executives on March 24
Learn How to Reduce Product Development Costs with SpaceClaim 3D Direct Modeling.
Concord, MA : SpaceClaim will host a half day event on March 24 focused on sharing techniques and strategies designed to leverage 3D direct modeling to lower product development costs. Customers will share how they are using SpaceClaim to grow revenue, eliminate waste and to reduce time-to-market. Applications to be discussed include bid modeling, concept modeling, CAE analysis and manufacturing model preparation.
Speakers will include:
* Jayeson Fougner, General Dynamics Land Systems
* Matt Thomas, Navistar
* Don Mekkes, Modern Tool
* Steve Costello, VP of Americas Sales, SpaceClaim
* Blake Courter, Co-Founder, SpaceClaim
* John Graham, Application Engineer, SpaceClaim
Details:
* March 24, 2011, 8:30 a.m. - 1:00 p.m.
* Embassy Suites Troy, 850 Tower Drive, Troy Michigan
* Complimentary Breakfast and Lunch to be served
To Register
To register please go to http://www.spaceclaim.com/en/Mkting/SpaceClaim-March-Detroit-Event.aspx or call 978-482-2206.
Concord, MA : SpaceClaim will host a half day event on March 24 focused on sharing techniques and strategies designed to leverage 3D direct modeling to lower product development costs. Customers will share how they are using SpaceClaim to grow revenue, eliminate waste and to reduce time-to-market. Applications to be discussed include bid modeling, concept modeling, CAE analysis and manufacturing model preparation.
Speakers will include:
* Jayeson Fougner, General Dynamics Land Systems
* Matt Thomas, Navistar
* Don Mekkes, Modern Tool
* Steve Costello, VP of Americas Sales, SpaceClaim
* Blake Courter, Co-Founder, SpaceClaim
* John Graham, Application Engineer, SpaceClaim
Details:
* March 24, 2011, 8:30 a.m. - 1:00 p.m.
* Embassy Suites Troy, 850 Tower Drive, Troy Michigan
* Complimentary Breakfast and Lunch to be served
To Register
To register please go to http://www.spaceclaim.com/en/Mkting/SpaceClaim-March-Detroit-Event.aspx or call 978-482-2206.
Filed under:
Events,
SpaceClaim
Mar 15, 2011
Registration Now Open for SmartGeometry 2011 Conference Taking Place April 1-2 in Copenhagen
Speakers Will Include Preeminent Authorities on Advanced 3D Design.
EXTON, Pa. – Bentley Systems, Incorporated announced that registration is now open for the SmartGeometry 2011 Conference. This highly anticipated conference is the world’s premier event focused on computational and parametric design tools, technologies, and methodologies that allow and encourage new forms of architectural and structural expression. The conference takes place April 1-2, 2011, in Copenhagen, Denmark, and carries the theme “Building the Invisible: Informing Digital Design With Real-World Data.” Among the many preeminent authorities on advanced 3D design presenting this year are Ben van Berkel, UNStudio; Usman Haque, Haque Design + Research; Billie Faircloth, KieranTimberlake; Craig Schwitter and Gijs Libourel, Buro Happold and Adaptive Building Initiative; Lisa Amini, IBM’s Smarter City Lab, Dublin; and Mette Ramsgard Thomsen, Center for Information Technology and Architecture (CITA).
The SmartGeometry 2011 Conference includes:
* “Talkshop” Day, April 1 – On this interactive first day, tutors and participants in the SmartGeometry 2011 Workshop companion event present and discuss their advanced design work of the previous four days in a series of panel sessions. The hands-on workshop is being held March 28-31, 2011, at the Royal Danish Academy of Fine Arts School of Architecture, and hosted by CITA. It enables architectural and engineering professionals, academics, and students to explore and realize design through the innovative use of data and digital fabrication employing GenerativeComponents – Bentley’s generative design software.
* “Symposium” Day, April 2 – Day two includes insightful presentations by renowned experts on the theory and practice of computational and parametric design approaches. The speakers will showcase major projects around the globe that exemplify the way in which data informs design.
* Reception, April 2 – The conference ends with a social gathering celebrating the innovation, creativity, and leadership of the generative design community. It also provides an opportunity to view the work developed during the four-day workshop.
Commenting on this year’s conference agenda, Shane Burger, head of the Computational Design Unit, Grimshaw Architects, said, “As digital designers, our challenge is to harness and direct the power of computation to inform our design process. Through parametric design, architects and engineers can collect, manage, and analyze a great deal of information about the environment in order to enable an array of design options for exploration. The goal is to use this information as meaningful inputs to help make better-informed design decisions. The SmartGeometry 2011 Conference, along with the workshop event, enables professionals and academics, designers and researchers to work together and explore the best use of technology-enabled methodologies. We are excited to again have Bentley as our premier sponsor and the use of Bentley’s GenerativeComponents as the primary software for the workshop.”
For additional information about the SmartGeometry 2011 Conference and to register, visit www.SmartGeometryConference.com/2011.
EXTON, Pa. – Bentley Systems, Incorporated announced that registration is now open for the SmartGeometry 2011 Conference. This highly anticipated conference is the world’s premier event focused on computational and parametric design tools, technologies, and methodologies that allow and encourage new forms of architectural and structural expression. The conference takes place April 1-2, 2011, in Copenhagen, Denmark, and carries the theme “Building the Invisible: Informing Digital Design With Real-World Data.” Among the many preeminent authorities on advanced 3D design presenting this year are Ben van Berkel, UNStudio; Usman Haque, Haque Design + Research; Billie Faircloth, KieranTimberlake; Craig Schwitter and Gijs Libourel, Buro Happold and Adaptive Building Initiative; Lisa Amini, IBM’s Smarter City Lab, Dublin; and Mette Ramsgard Thomsen, Center for Information Technology and Architecture (CITA).
The SmartGeometry 2011 Conference includes:
* “Talkshop” Day, April 1 – On this interactive first day, tutors and participants in the SmartGeometry 2011 Workshop companion event present and discuss their advanced design work of the previous four days in a series of panel sessions. The hands-on workshop is being held March 28-31, 2011, at the Royal Danish Academy of Fine Arts School of Architecture, and hosted by CITA. It enables architectural and engineering professionals, academics, and students to explore and realize design through the innovative use of data and digital fabrication employing GenerativeComponents – Bentley’s generative design software.
* “Symposium” Day, April 2 – Day two includes insightful presentations by renowned experts on the theory and practice of computational and parametric design approaches. The speakers will showcase major projects around the globe that exemplify the way in which data informs design.
* Reception, April 2 – The conference ends with a social gathering celebrating the innovation, creativity, and leadership of the generative design community. It also provides an opportunity to view the work developed during the four-day workshop.
Commenting on this year’s conference agenda, Shane Burger, head of the Computational Design Unit, Grimshaw Architects, said, “As digital designers, our challenge is to harness and direct the power of computation to inform our design process. Through parametric design, architects and engineers can collect, manage, and analyze a great deal of information about the environment in order to enable an array of design options for exploration. The goal is to use this information as meaningful inputs to help make better-informed design decisions. The SmartGeometry 2011 Conference, along with the workshop event, enables professionals and academics, designers and researchers to work together and explore the best use of technology-enabled methodologies. We are excited to again have Bentley as our premier sponsor and the use of Bentley’s GenerativeComponents as the primary software for the workshop.”
For additional information about the SmartGeometry 2011 Conference and to register, visit www.SmartGeometryConference.com/2011.
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