Spatial Integrated Systems, Inc. ("SIS"), a leader in the development and integration of solutions incorporating next generation digital 3D data capture and processing technologies, announced today that it has been awarded U.S. patent 7,986,321 for a system and method for generating structured light for three-dimensional image rendering.
"We are pleased that our technical efforts have resulted in the award of another patent, reflecting the ingenuity of our design team," said Dr. Ali Farsaie, President and CEO of SIS. "This latest technology [3D SNAPSHOT] represents a significant leap forward in the area of three-dimensional imaging and rendering using cost-effective equipment," said Farsaie.
SIS plans to use this new technology for applications including biometrics, robotics navigation, reverse engineering and design prototyping. "This technology will improve homeland security and commercial applications," said Greg Walker, Director of Marketing. "End-users of three-dimensional imaging will benefit strongly from the vast improvements in data quality that SIS's 3D SNAPSHOT offers."
Popular Articles
- Surfware's free SURFCAM Student Learning Version Now Available for download
- OpenDXM® GlobalX 6.2 Offers Multitude of New Functions
- Z Corp. Named to 2008 Inc. As One of America's Fastest Growing Companies
- Aras Expands Global Headquarters for Growth and Announces Several New Job Openings
- Synopsys Introduces Lynx Design System
- Zeus Numerix becomes first research partner to the newly opened EADS R&D center at Bangalore
- Ariela Alpha International, LLC Selects Lectra's Modaris ExpertPro to Improve Efficiency and Speed Product Development of Global Designs
