Spatial Integrated Systems, Inc. ("SIS"), a leader in the development and integration of solutions incorporating next generation digital 3D data capture and processing technologies, announced today that it has been awarded U.S. patent 7,986,321 for a system and method for generating structured light for three-dimensional image rendering.
"We are pleased that our technical efforts have resulted in the award of another patent, reflecting the ingenuity of our design team," said Dr. Ali Farsaie, President and CEO of SIS. "This latest technology [3D SNAPSHOT] represents a significant leap forward in the area of three-dimensional imaging and rendering using cost-effective equipment," said Farsaie.
SIS plans to use this new technology for applications including biometrics, robotics navigation, reverse engineering and design prototyping. "This technology will improve homeland security and commercial applications," said Greg Walker, Director of Marketing. "End-users of three-dimensional imaging will benefit strongly from the vast improvements in data quality that SIS's 3D SNAPSHOT offers."
Popular Articles
- Femap® From Siemens PLM Software Now Sold Worldwide Through NEi Software's Reseller Network
- Automotive Tier-One Suppliers Adopt TPM for Faster, Automated Data Translations
- Sescoi's WorkNC 5-Axis and Auto 5 - a competitive advantage at ALLIO
- Infotech Enterprises's revenue Rs 2327.5mn for 3rd quarter ended December 31, 2008
- Autodesk Acquires T-Splines Modeling Technology Assets
- GibbsCAM 2009 Shipping to Customers
- Autodesk Unveils First Flexible Software Delivery Model for CAD Industry
- Norwegian Architecture Firm Wins Monthly "Experience BIM" Competition
- Michael Schley named as 2008 ifma fellow
- Visteon Technology Helps Drivers to Be More Aware of Surroundings
